{"cveID":"CVE-2023-33063","vendorProject":"Qualcomm","product":"Multiple Chipsets","vulnerabilityName":"Qualcomm Multiple Chipsets Use-After-Free Vulnerability","dateAdded":"2023-12-05","shortDescription":"Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.","requiredAction":"Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.","dueDate":"2023-12-26","knownRansomwareCampaignUse":"Unknown","notes":"This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110;  https://nvd.nist.gov/vuln/detail/CVE-2023-33063","cwes":["CWE-416"],"year":2023,"state":"unmapped","stale_reasons":[],"mappings":[],"techniques":[],"mapping_types":[],"has_exploitation_technique":false,"mapping_attack_versions":[],"mapping_domains":[],"sigma_coverage":null,"sigma_rules_tagged_cve":[],"added_after_mapping_snapshot":false,"_source":"kevmap","_built":"2026-08-24 19:45 UTC","_attack_version":"19.2"}